The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Oct. 29, 2014
Applicant:
Semes Co., Ltd., Chungcheongnam-do, KR;
Inventors:
Wonhaeng Lee, Chungcheongnam-do, KR;
Kangrae Ha, Chungcheongnam-do, KR;
Assignee:
SEMES CO., LTD., Chungcheongnam-do, KR;
Primary Examiner:
Int. Cl.
CPC ...
C03C 25/68 (2006.01); G03B 27/58 (2006.01); H01L 21/683 (2006.01); B23K 1/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); H01J 37/32082 (2013.01); H01J 37/32715 (2013.01); H01L 21/67063 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); G03F 7/70708 (2013.01);
Abstract
Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.