The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

May. 13, 2014
Applicant:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Inventors:

Cheng-Wei Hsu, Taoyuan Hsien, TW;

Hung-Chuan Chen, Taoyuan Hsien, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H05K 7/2049 (2013.01); H05K 1/0203 (2013.01); H05K 3/3447 (2013.01); H05K 2201/066 (2013.01); H05K 2201/105 (2013.01); H05K 2201/10409 (2013.01); Y10T 29/49142 (2015.01);
Abstract

A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.


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