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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9622383 B1

PDFFull Text
Date of Patent:
Apr. 11, 2017

Filed:

Jan. 29, 2014

Heat radiation structure of electric device and method for manufacturing the same

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Takahiro Yamanaka, Kariya, JP;

Yoshimichi Hara, Kuwana, JP;

Toshihisa Yamamoto, Anjo, JP;

Kouji Kameyama, Anjo, JP;

Yuuji Kobayashi, Nukata-gun, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Zachary M Pape

Assistant Examiner:

Amir Jalali

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/22 (2006.01); H05K 3/30 (2006.01); H02M 7/00 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 3/46 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H02M 7/003 (2013.01); H05K 1/0265 (2013.01); H05K 3/0058 (2013.01); H05K 3/10 (2013.01); H05K 3/22 (2013.01); H05K 3/303 (2013.01); H05K 7/209 (2013.01); H01L 23/5389 (2013.01); H01L 2924/0002 (2013.01); H05K 1/185 (2013.01); H05K 3/4614 (2013.01); H05K 2201/10166 (2013.01); Y10T 29/49126 (2015.01); Y10T 29/49139 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.

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