The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Sep. 27, 2011
Applicants:
Adrien Gasse, Grenoble, FR;
Pascal Revirand, Saint-egreve, FR;
Inventors:
Adrien Gasse, Grenoble, FR;
Pascal Revirand, Saint-egreve, FR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 3/30 (2006.01); F21V 29/87 (2015.01); F21V 29/71 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); F21V 29/87 (2015.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01); H01L 23/3737 (2013.01); H05K 3/30 (2013.01); F21V 29/717 (2015.01); F21Y 2115/10 (2016.08); H01L 2924/0002 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A heat-sink device intended for at least one electronic component (), includes: a heat-sink; a substrate () for the at least one electronic component (), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins (), and the thermal-coupling () is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate () and the fins ().