The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Aug. 24, 2012
Applicants:
Ryo Tsuda, Tokyo, JP;
Kazuhiro Morishita, Tokyo, JP;
Inventors:
Ryo Tsuda, Tokyo, JP;
Kazuhiro Morishita, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/46 (2006.01); H05K 5/00 (2006.01); H05K 7/02 (2006.01); H01L 23/498 (2006.01); H01L 25/11 (2006.01); H01L 23/04 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 23/04 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 25/105 (2013.01); H01L 25/115 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0263 (2013.01);
Abstract
Each of semiconductor module includes a semiconductor chip, a case surrounding the semiconductor chip, and a main electrode connected to the semiconductor chip and led out to an upper surface of case. A connecting electrode is connected and fixed to the main electrodes of the adjacent semiconductor modules. The connecting electrode is formed only of a metal plate.