The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Mar. 03, 2016
Fuji Electric Co., Ltd., Kanagawa, JP;
Kyohei Fukuda, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
It is aimed to reduce the electrical field intensity at a laminate substrate on which a semiconductor device is placed. A semiconductor module includes a laminate substrate including an insulative plate, a circuit board provided on a first surface of the insulative plate and a metal plate provided on a second surface that is opposite to the first surface, and an interconnecting substrate that is provided so as to oppose the laminate substrate and that includes a metal layer. Here, the insulative plate extends more outside than an outer edge portion of the circuit board, and the metal layer has a region overlapping the outer edge portion of the circuit board and extends more outside than the outer edge portion of the circuit board.