The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Aug. 31, 2010
Applicants:
Chung-yi Su, Cupertino, CA (US);
Tak K. Wang, Cupertino, CA (US);
Inventors:
Chung-Yi Su, Cupertino, CA (US);
Tak K. Wang, Cupertino, CA (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/042 (2006.01); H01S 5/42 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/423 (2013.01); H01S 5/0224 (2013.01); H01S 5/02252 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02284 (2013.01);
Abstract
A known flip-chip assembly manufacturing process is augmented by process steps of the invention to create a VCSEL flip-chip assembly comprising a plurality of semiconductor devices having respective arrays of a small number of VCSELs thereon, which are mounted on a substrate to form a large array of VCSELs that are precisely optically aligned with their respective optical coupling elements.