The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jul. 04, 2012
Applicants:

Atsushi Sugiyama, Hamamatsu, JP;

Naota Akikusa, Hamamatsu, JP;

Tadataka Edamura, Hamamatsu, JP;

Inventors:

Atsushi Sugiyama, Hamamatsu, JP;

Naota Akikusa, Hamamatsu, JP;

Tadataka Edamura, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/34 (2006.01); H01S 3/08 (2006.01); B82Y 10/00 (2011.01); B82Y 20/00 (2011.01); B82Y 40/00 (2011.01); H01S 5/12 (2006.01); B29C 33/42 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01S 3/08009 (2013.01); B82Y 10/00 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); H01S 5/124 (2013.01); H01S 5/3401 (2013.01); B29C 33/424 (2013.01); B29C 2033/426 (2013.01); G03F 7/0002 (2013.01); H01S 5/3402 (2013.01);
Abstract

A quantum cascade laser manufacturing method includes: a step of pressing a mother stamper against a resin film having flexibility to make a resin stamperhaving a second groove pattern P; a step of making a wafer with an active layer formed on a semiconductor substrate; a step of forming a resist filmon a surface on the active layer side of the wafer; a step of pressing the resin stamper against the resist filmby air pressure to form a third groove pattern Pon the resist film; and a step of etching the wafer with the resist filmserving as a mask to form a diffraction grating on a surface of the wafer.


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