The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jan. 12, 2016
Applicant:

Cambridge Display Technology, Ltd., Godmanchester, GB;

Inventors:

Surama Malik, Cambridge, GB;

Colin Baker, Cambridge, GB;

Laurence Scullion, Huntington, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5206 (2013.01); H01L 21/02697 (2013.01); H01L 51/0021 (2013.01); H01L 51/5088 (2013.01); H01L 51/5209 (2013.01); H01L 51/5221 (2013.01); H01L 51/56 (2013.01); H01L 2251/301 (2013.01);
Abstract

A method of forming a light-emitting device comprises: forming patterned portions of precursor material over a substrate, the edges of the patterned portions defining sidewalls; performing a shaping control process on the patterned portions of precursor material to control the sidewall profile to reduce the angle the sidewalls of the precursor material make with the substrate to less than 15 degrees; selectively applying from solution a conductive coating onto the portions of shaped precursor material so as to form a plurality of first conducting contacts such that an upper surface of said conductive coating follows the sidewall profile of the precursor material; forming a light-emitting layer over the conductive contacts and substrate, and forming a plurality of second conducting contacts over the light-emitting layer. The precursor material may comprises an activator catalyst and the conductive coating comprises a metal selectively applied to the shaped precursor material by electroless plating.


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