The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Sep. 28, 2012
Applicant:
Daishinku Corporation, Kakogawa-shi, Hyogo, JP;
Inventor:
Naoki Kohda, Kakogawa, JP;
Assignee:
DAISHINKU CORPORATION, Kakogawa-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/23 (2013.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H01L 41/23 (2013.01); H03H 9/0519 (2013.01); H03H 9/1021 (2013.01); H01L 2924/0002 (2013.01); H03H 2003/022 (2013.01); H03H 2003/026 (2013.01);
Abstract
The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through holeis formed in a baseso as to pass through between both main surfacesandof a base material of the base. An inner side surfaceof the through holeincludes a curved surfacethat expands outward in a width direction of the through hole