The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Oct. 07, 2015
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Yau-Tzu Jang, Hsinchu, TW;
Yu-Liang Huang, Hsinchu, TW;
Wen-Liang Tseng, Hsinchu, TW;
Pin-Chuan Chen, Hsinchu, TW;
Lung-Hsin Chen, Hsinchu, TW;
Hsing-Fen Lo, Hsinchu, TW;
Chao-Hsiung Chang, Hsinchu, TW;
Che-Hsang Huang, Hsinchu, TW;
Yu-Lun Hsieh, Hsinchu, TW;
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., Hsinchu Hsien, TW;
Abstract
An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.