The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Dec. 26, 2013
Applicant:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Inventor:

Kiyokazu Hino, Yokosuka, JP;

Assignee:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); F21V 23/02 (2006.01); F21V 23/06 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); F21S 8/10 (2006.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); F21V 29/76 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21S 8/10 (2013.01); F21V 19/005 (2013.01); F21V 23/02 (2013.01); F21V 23/06 (2013.01); H01L 24/49 (2013.01); H01L 25/0753 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); F21V 29/763 (2015.01); F21Y 2115/10 (2016.08); H01L 24/45 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49 (2013.01);
Abstract

Disclosed is a lighting system including: a board; a wiring pattern that is provided on a surface of the board and has a wiring pad; a light emitting element that is provided on the wiring pattern and includes an electrode on a surface thereof opposite to a surface thereof provided on the wiring pattern; a surrounding wall member that is provided to surround the light emitting element; a wiring that connects the wiring pad and the electrode; and a sealing portion that is provided inside the surrounding wall member and covers the light emitting element and the wiring. Here, an angle that is formed by a segment that connects a central position of a portion of the board surrounded by the surrounding wall member and a position where the wiring is connected to the wiring pad, and the wiring is 0° to 45°, or 135° to 180°.


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