The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jun. 16, 2016
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Daisuke Sanga, Tokushima, JP;

Yuta Oka, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/50 (2010.01); H01L 21/48 (2006.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/46 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface () parallel to a lamination direction of a semiconductor layer (). The semiconductor light emitting device includes a light guide member () placed on the semiconductor layer () and having a sloped surface () with a side surface opposite to the light extraction surface () sloped to the light extraction surface and a light-reflecting member () placed on a surface of the light guide member including at least the sloped surface of the light guide member.


Find Patent Forward Citations

Loading…