The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Oct. 29, 2015
Robert Woehl, San Jose, CA (US);
Richard Hamilton Sewell, Los Altos, CA (US);
Mohamed A. Elbandrawy, Danville, CA (US);
Taeseok Kim, San Jose, CA (US);
Thomas P. Pass, San Jose, CA (US);
Benjamin Ian Hsia, Fremont, CA (US);
David Fredric Joel Kavulak, Fremont, CA (US);
Nils-peter Harder, San Jose, CA (US);
Robert Woehl, San Jose, CA (US);
Richard Hamilton Sewell, Los Altos, CA (US);
Mohamed A. Elbandrawy, Danville, CA (US);
Taeseok Kim, San Jose, CA (US);
Thomas P. Pass, San Jose, CA (US);
Benjamin Ian Hsia, Fremont, CA (US);
David Fredric Joel Kavulak, Fremont, CA (US);
Nils-Peter Harder, San Jose, CA (US);
SunPower Corporation, San Jose, CA (US);
Total Marketing Services, Puteaux, FR;
Abstract
Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.