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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9620542 B1

PDFFull Text
Expired
Date of Patent:
Apr. 11, 2017

Filed:

May. 29, 2015

Curable resin composition, production method of image sensor chip using the same, and image sensor chip

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Toshihide Ezoe, Shizuoka, JP;

Kazuto Shimada, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Victor A Mandala

Assistant Examiner:

Colleen E Snow

Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 27/146 (2006.01); C09D 7/12 (2006.01); C09D 201/00 (2006.01); C08L 101/00 (2006.01); H04N 5/225 (2006.01); H04N 5/335 (2011.01); G02B 5/22 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14623 (2013.01); C08L 101/00 (2013.01); C09D 7/12 (2013.01); C09D 201/00 (2013.01); G02B 5/223 (2013.01); H01L 27/1462 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H04N 5/225 (2013.01); H04N 5/2254 (2013.01); H04N 5/335 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.

Find Patent Forward Citations

Ezoe, Toshihide. (2017). Curable resin composition, production method of image sensor chip using the same, and image sensor chip (U.S. Patent No. 9620542). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9620542

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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