The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Jun. 03, 2015
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Jung Tae Jeong, Icheon-si, KR;
SK HYNIX INC., Icheon-si, KR;
Abstract
A bottom package having a first semiconductor chip and first connection members; and a top package disposed over the bottom package, and having a second semiconductor chip and second connection members electrically coupled with the first connection members. The bottom package includes an interposer having electrodes arranged along edges; first bond fingers arranged by being separated from the edges of the interposer; a first semiconductor chip disposed over the interposer to expose the electrodes, and having first bonding pads; first bonding wires electrically coupling the first bonding pads and the electrodes; second bonding wires electrically coupling the electrodes and the first bond fingers; and a first encapsulation member formed to cover the first bond fingers, the upper and side surfaces of the interposer and the first semiconductor chip, and the first and second bonding wires, and having via holes which expose portions of the second bonding wires.