The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Dec. 16, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Seung Hwan Choi, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/10 (2006.01); H01L 23/525 (2006.01); H01L 23/62 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/10 (2013.01); H01L 23/5256 (2013.01); H01L 23/62 (2013.01); H01L 24/05 (2013.01); H01L 33/62 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a portion of the first lead frame and at least a portion of the second lead frame, a wire fuse mounted on the first lead frame and the second lead frame, and configured to electrically connect the two lead frames, and an encapsulator configured to cover the wire fuse.