The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Oct. 30, 2015
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Young Hee Yoon, Icheon-si, KR;
Ga Young Lee, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 23/175 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 49/02 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/481 (2013.01); H01L 23/5286 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 28/40 (2013.01); H01L 2224/05025 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device including power TSVs for stably supplying a power source is described. A semiconductor device includes a chip power pad placed in a first region of a chip, power through silicon vias (TSVs) connected to the chip power pad and placed in the second region of each of the chips, and metal lines configured to couple the chip power pad and the power TSVs.