The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Feb. 13, 2012
Applicants:

Andreas Bibl, Los Altos, CA (US);

John A. Higginson, Santa Clara, CA (US);

Hung-fai Stephen Law, Los Altos, CA (US);

Hsin-hua HU, Los Altos, CA (US);

Inventors:

Andreas Bibl, Los Altos, CA (US);

John A. Higginson, Santa Clara, CA (US);

Hung-Fai Stephen Law, Los Altos, CA (US);

Hsin-Hua Hu, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/67144 (2013.01); H01L 21/6833 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); B32B 2457/20 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15153 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/1707 (2015.01); Y10T 156/1744 (2015.01); Y10T 156/1749 (2015.01); Y10T 156/1776 (2015.01);
Abstract

A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.


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