The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jun. 17, 2014
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

David Otto Whitt, III, Sammamish, WA (US);

Timothy C. Shaw, Sammamish, WA (US);

Rob Huala, Bellevue, WA (US);

David C. Vandervoort, Seattle, WA (US);

Matthew David Mickelson, Seattle, WA (US);

Christopher Harry Stoumbos, Sammamish, WA (US);

Joel Lawrence Pelley, Bellevue, WA (US);

Todd David Pleake, Sammamish, WA (US);

Hua Wang, Sammamish, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 13/78 (2006.01); G06F 1/16 (2006.01); H01H 13/79 (2006.01); H01H 13/785 (2006.01); G06F 3/02 (2006.01); H05K 5/02 (2006.01); H04M 1/02 (2006.01); H04M 1/725 (2006.01); G05B 11/01 (2006.01); G06F 3/041 (2006.01); H01H 13/704 (2006.01); H01H 13/82 (2006.01); G06F 3/00 (2006.01); G06F 3/01 (2006.01); H01H 13/702 (2006.01); H01H 13/14 (2006.01); H01H 13/703 (2006.01); G06F 9/54 (2006.01); G06F 11/30 (2006.01); G06F 13/10 (2006.01); G06F 3/023 (2006.01); G06F 3/0488 (2013.01); G06F 3/0487 (2013.01); H01H 13/807 (2006.01); H01H 11/00 (2006.01); E05D 11/10 (2006.01); E05F 5/08 (2006.01); F16M 11/38 (2006.01); H01H 9/26 (2006.01);
U.S. Cl.
CPC ...
G06F 1/166 (2013.01); E05D 11/1064 (2013.01); E05F 5/08 (2013.01); F16M 11/38 (2013.01); G05B 11/01 (2013.01); G06F 1/1616 (2013.01); G06F 1/1618 (2013.01); G06F 1/1637 (2013.01); G06F 1/1654 (2013.01); G06F 1/1656 (2013.01); G06F 1/1662 (2013.01); G06F 1/1669 (2013.01); G06F 1/1681 (2013.01); G06F 1/1683 (2013.01); G06F 1/1684 (2013.01); G06F 1/1686 (2013.01); G06F 3/002 (2013.01); G06F 3/01 (2013.01); G06F 3/0202 (2013.01); G06F 3/023 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); G06F 3/0487 (2013.01); G06F 3/0488 (2013.01); G06F 9/541 (2013.01); G06F 11/3089 (2013.01); G06F 13/102 (2013.01); H01H 11/00 (2013.01); H01H 13/14 (2013.01); H01H 13/702 (2013.01); H01H 13/703 (2013.01); H01H 13/704 (2013.01); H01H 13/78 (2013.01); H01H 13/785 (2013.01); H01H 13/79 (2013.01); H01H 13/807 (2013.01); H01H 13/82 (2013.01); H04M 1/0216 (2013.01); H04M 1/0254 (2013.01); H04M 1/72527 (2013.01); H05K 5/0226 (2013.01); H05K 5/0234 (2013.01); H01H 9/26 (2013.01); H01H 2201/036 (2013.01); H01H 2203/02 (2013.01); H01H 2205/006 (2013.01); H01H 2211/004 (2013.01); H01H 2211/006 (2013.01); H01H 2213/016 (2013.01); H01H 2217/004 (2013.01); H01H 2217/01 (2013.01); H04M 1/0245 (2013.01); Y02B 60/1228 (2013.01); Y10T 16/5401 (2015.01); Y10T 16/551 (2015.01); Y10T 29/49826 (2015.01);
Abstract

Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.


Find Patent Forward Citations

Loading…