The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Oct. 22, 2013
Applicant:

Oracle International Corporation, Redwood City, CA;

Inventors:

Xuezhe Zheng, San Diego, CA (US);

Ivan Shubin, San Diego, CA (US);

Ying Luo, San Diego, CA (US);

Guoliang Li, San Diego, CA (US);

Ashok V. Krishnamoorthy, San Diego, CA (US);

Assignee:

ORACLE INTERNATIONAL CORPORATION, Redwood Shores, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/14 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4224 (2013.01); G02B 6/14 (2013.01);
Abstract

A technique for fabricating a hybrid optical source is described. During this fabrication technique, a III-V compound-semiconductor active gain medium is integrated with a silicon-on-insulator (SOI) chip (or wafer) using edge coupling to form a co-planar hybrid optical source. Using a backside etch-assisted cleaving technique, and a temporary transparent substrate with alignment markers, a III-V compound-semiconductor chip with proper edge polish and coating can be integrated with a processed SOI chip (or wafer) with accurate alignment. This fabrication technique may significantly reduce the alignment complexity when fabricating the hybrid optical source, and may enable wafer-scale integration.


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