The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jan. 27, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Sean A. Mayo, Mountain View, CA (US);

Shankar S. Pennathur, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/02 (2006.01); B05D 1/28 (2006.01); G01R 31/28 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2818 (2013.01); H05K 1/0268 (2013.01); H05K 1/147 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09163 (2013.01);
Abstract

Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.


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