The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Jun. 05, 2014
The Boeing Company, Seal Beach, CA (US);
Kevin R. Housen, Tacoma, WA (US);
William J. Sweet, Seattle, WA (US);
THE BOEING COMPANY, Chicago, IL (US);
Abstract
A system and methods are provided for evaluating a bond between structures. The system includes an assembly of at least two bonded structures. The assembly has a front surface, a back surface, a thickness, and a bond disposed between the front surface and the back surface. At least one delay component is attached to the front surface of the assembly having a body having a front face, a back face, and a thickness. The system further includes a laser source capable of depositing laser energy onto a front face of the delay component, where a first portion of the laser energy is absorbed by the front face of the delay component to generate a first compression wave that propagates through the body of the delay component. A second portion of the laser energy is absorbed by the back face of the component to generate a second compression wave that reflects off of the back surface of the assembly to produce a tensile wave that stresses the bond.