The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Mar. 21, 2011
Applicants:
Andreas Königshofen, Leverkusen, DE;
Danica Elbick, Solingen, DE;
Markus Dahlhaus, Schermbeck, DE;
Inventors:
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/54 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C23C 18/40 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/34 (2006.01); C23C 18/36 (2006.01); C23C 18/44 (2006.01); C23C 18/52 (2006.01); C25D 11/00 (2006.01);
U.S. Cl.
CPC ...
C23C 18/54 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/208 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01); C23C 18/34 (2013.01); C23C 18/36 (2013.01); C23C 18/40 (2013.01); C23C 18/44 (2013.01); C23C 18/52 (2013.01); C25D 11/00 (2013.01);
Abstract
The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.