The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Oct. 25, 2013
Applicant:

Board of Trustees of Michigan State University, East Lansing, MI (US);

Inventors:

Ilsoon Lee, Okemos, MI (US);

Wei Wang, East Lansing, MI (US);

Ankush Gokhale, East Lansing, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/20 (2006.01); C23C 18/30 (2006.01);
U.S. Cl.
CPC ...
C23C 18/2086 (2013.01); C23C 18/30 (2013.01);
Abstract

A method of plating a metal on a hydrophobic polymer, especially in the shape of small particles, involves: (a) contacting a surface of hydrophobic polymer substrate with a polycation such as poly(allylamine hydrochloride) to create a treated surface; (b) contacting the treated surface with a catalyst; and then (c) immersing the surface in a electroless metal plating bath to create a coating of metal on the surface. Metals include copper, silver, gold, nickel and cobalt. Catalysts are selected from compounds containing palladium, platinum, tin, copper, or nickel salts. Damaging surface treatments such as etching by plasma or acid are avoided.


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