The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Aug. 13, 2009
Applicants:
Tadao Okimoto, Takasago, JP;
Hiroshi Tamagaki, Takasago, JP;
Inventors:
Tadao Okimoto, Takasago, JP;
Hiroshi Tamagaki, Takasago, JP;
Assignee:
Kobe Steel, Ltd, Kobe-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3464 (2013.01); C23C 14/3485 (2013.01); H01J 37/32027 (2013.01); H01J 37/34 (2013.01); H01J 37/3444 (2013.01);
Abstract
In a sputter device (), power of a DC power source () is sequentially distributed and supplied in a time division pulse state to a plurality of sputter evaporation sources (). A power source () provided to each of the sputter evaporation sources () supplies continuous power to each of the sputter evaporation sources (). The sputter device () having the configuration requires no DC pulse power source to be provided to each of the sputter evaporation sources (), which reduces the device cost.