The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jan. 09, 2015
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Takuro Oda, Otsu, JP;

Daisuke Kanamori, Otsu, JP;

Toshihisa Nonaka, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09D 163/00 (2006.01); C09J 7/02 (2006.01); C09J 179/08 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); C08G 73/10 (2006.01); C09J 163/00 (2006.01); C08K 3/00 (2006.01); H01L 23/29 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08G 73/106 (2013.01); C09D 163/00 (2013.01); C09J 7/02 (2013.01); C09J 7/026 (2013.01); C09J 7/0296 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); H01L 21/6836 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); C08G 2170/00 (2013.01); C08K 3/0033 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2479/00 (2013.01); H01L 23/293 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H05K 3/321 (2013.01);
Abstract

The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.


Find Patent Forward Citations

Loading…