The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Mar. 18, 2011
Applicants:
Takahiro Ota, Tokyo, JP;
Daisuke Ogura, Tokyo, JP;
Atsushi Sugai, Tokyo, JP;
Ken Ishii, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 11/02 (2006.01); B21D 11/08 (2006.01); B21D 11/20 (2006.01);
U.S. Cl.
CPC ...
B21D 11/08 (2013.01); B21D 11/206 (2013.01); B21D 11/02 (2013.01); Y10T 428/1241 (2015.01);
Abstract
Provided is a molding method for a plate-shaped workpiece including forming a concave portion () at one surface () of a plate-shaped workpiece (), and bending the plate-shaped workpiece () having the concave portion () such that the one surface () becomes a concave surface and a rear surface () thereof becomes a convex surface.