The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Nov. 29, 2013
Applicant:

Continental Teves Ag & Co. Ohg, Frankfurt, DE;

Inventors:

Jakob Schillinger, Gaimersheim, DE;

Günther Romhart, Süssen, DE;

Yann Dinard, Frankfurt am Main, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/28 (2006.01); H05K 5/00 (2006.01); G01R 1/04 (2006.01); G01R 33/09 (2006.01); G01D 11/24 (2006.01); G01D 18/00 (2006.01); H05K 3/28 (2006.01); H01L 23/544 (2006.01); H05K 1/02 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0034 (2013.01); G01D 11/245 (2013.01); G01D 18/00 (2013.01); G01R 1/04 (2013.01); G01R 33/09 (2013.01); H01L 23/544 (2013.01); H05K 1/0266 (2013.01); H05K 3/284 (2013.01); H05K 5/003 (2013.01); H05K 5/0017 (2013.01); H05K 5/062 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/49147 (2015.01);
Abstract

An electronic device including: an electronic unit accommodated in a circuit housing and a molded body which surrounds the circuit housing. The molding compound has a cut-out that exposes the circuit housing, in which cut-out an identification that characterizes the electronic circuit is arranged.


Find Patent Forward Citations

Loading…