The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

May. 28, 2015
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventor:

Chia-Hsin Wu, Hsinchu, TW;

Assignee:

Wistron NeWeb Corp., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0231 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10545 (2013.01); Y02P 70/611 (2015.11);
Abstract

A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other.


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