The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Nov. 15, 2013
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ji-Young Hwang, Daejeon, KR;

In-Seok Hwang, Daejeon, KR;

Dong-Wook Lee, Daejeon, KR;

Min-Choon Park, Daejeon, KR;

Seung-Heon Lee, Daejeon, KR;

Sang-Ki Chun, Daejeon, KR;

Yong-Koo Son, Daejeon, KR;

Beom-Mo Koo, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); G06F 3/045 (2006.01); H01L 31/0224 (2006.01); H05K 3/06 (2006.01); G03F 7/40 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); G06F 3/045 (2013.01); H01L 31/022425 (2013.01); H05K 3/061 (2013.01); H05K 3/10 (2013.01); G03F 7/40 (2013.01); G06F 2203/04103 (2013.01); H05K 3/0079 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0537 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1184 (2013.01); Y02E 10/50 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49156 (2015.01);
Abstract

The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.


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