The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Jul. 23, 2012
Applicants:

Dror Hurwitz, Zhuhai, CN;

Alex Huang, Qianwu Town, CN;

Inventors:

Dror Hurwitz, Zhuhai, CN;

Alex Huang, Qianwu Town, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 2924/0002 (2013.01); H05K 1/11 (2013.01); H05K 2201/09781 (2013.01);
Abstract

A multilayer electronic support structure including at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one constructional element through the dielectric material spanning between said pair of adjacent feature layers in a Z direction perpendicular to the X-Y plane; wherein said at least one constructional element is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane and wherein the at least one constructional element is fully encapsulated within the dielectric material and is electrically isolated from its surrounding.


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