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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9614295 B1

PDFFull Text
Date of Patent:
Apr. 04, 2017

Filed:

Oct. 21, 2015

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kosuke Nakano, Nagaokakyo, JP;

Hidekiyo Takaoka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 101/36 (2006.01); H01R 4/02 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); H01R 4/58 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01R 4/58 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0272 (2013.01); Y10T 403/479 (2015.01);
Abstract

A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a CuSn layer nor a CuSnlayer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.

Find Patent Forward Citations

Nakano, Kosuke. (2017). Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part (U.S. Patent No. 9614295). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9614295

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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