The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Oct. 21, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Kosuke Nakano, Nagaokakyo, JP;
Hidekiyo Takaoka, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 101/36 (2006.01); H01R 4/02 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); H01R 4/58 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01R 4/58 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0272 (2013.01); Y10T 403/479 (2015.01);
Abstract
A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a CuSn layer nor a CuSnlayer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.