The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Oct. 09, 2013
Hitachi Chemical Company, Ltd., Tokyo, JP;
Takashi Naito, Tokyo, JP;
Shinichi Tachizono, Tokyo, JP;
Kei Yoshimura, Tokyo, JP;
Yuji Hashiba, Tokyo, JP;
Takuya Aoyagi, Tokyo, JP;
Masanori Miyagi, Tokyo, JP;
Motomune Kodama, Tokyo, JP;
Yuichi Sawai, Tokyo, JP;
Tadashi Fujieda, Tokyo, JP;
Takeshi Tsukamoto, Tokyo, JP;
Hajime Murakami, Tokyo, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.