The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Jul. 29, 2013
Applicants:

Cambridge Enterprise Limited, Cambridge, GB;

Technische Universiteit Eindhoven, Eindhoven, NL;

Eidgenoessische Technische Hochschule Zuerich, Zurich, CH;

Inventors:

Henning Sirringhaus, Cambridge, GB;

Shalom Goffri, Cambridge, MA (US);

Rene A. J. Janssen, Eindhoven, NL;

Christopher Paul Radano, Broomall, PA (US);

Paul Smith, Zurich, CH;

Christian Muller, Zurich, CH;

Pascal Wolfer, Zurich, CH;

Natalie Stingelin-Stutzmann, London, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0034 (2013.01); H01L 51/0012 (2013.01); H01L 51/0566 (2013.01); H01L 51/0036 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); Y02E 10/549 (2013.01);
Abstract

A method for forming a semiconductor body, the method comprising: forming a mixture of an organic semiconducting material and a binder material; causing the semiconducting material to at least partially solidify; and causing the binder material to crystallize in such a way as to cause the semiconducting material to at least partially segregate from the binder material.


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