The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Mar. 04, 2014
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, JP;

Inventors:

Yoshiyuki Isomura, Osaka, JP;

Katsuhiro Kikuchi, Osaka, JP;

Shinichi Kawato, Osaka, JP;

Satoshi Inoue, Osaka, JP;

Takashi Ochi, Osaka, JP;

Yuhki Kobayashi, Osaka, JP;

Eiichi Matsumoto, Mitsuke, JP;

Masahiro Ichihara, Mitsuke, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01); C23C 16/458 (2006.01); H01L 51/50 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0011 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01); C23C 16/458 (2013.01); H01L 27/3241 (2013.01); H01L 51/50 (2013.01); H01L 51/5012 (2013.01);
Abstract

The vapor deposition apparatus employs scanning vapor deposition, and includes a limiting component including a first plate portion; a second plate portion provided with a space from the first plate portion; and a joint portion combining the first plate portion with the second plate portion, the first plate portion being provided with an first opening, the second plate portion being provided with an second opening that faces the first opening, the vapor deposition apparatus including a first space between the first opening and the second opening, the vapor deposition apparatus including a second space between the first plate portion and the second plate portion, the first space being connected to the second space, the vapor deposition apparatus including a third space that is in the outside of the limiting component, the second space being connected to the third space.


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