The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Nov. 10, 2015
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;
Inventors:
Assignee:
TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); H05K 1/11 (2006.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/644 (2013.01); H05K 1/115 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A light emitting device includes: a heat dissipative board; a wiring board which adheres and is fixed to the heat dissipative board and in which a through-hole is formed; a light-emitting element which is mounted on a front surface of the heat dissipative board which is exposed through the through-hole of the wiring board; a bonding wire which connects the light-emitting element and the wiring board; and a light-reflecting member which covers a surface of an inner peripheral wall of the through-hole excluding disposition places of the light-emitting element and the bonding wire.