The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Jul. 05, 2013
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chien-Fu Huang, Hsinchu, TW;

Yao-Ning Chan, Hsinchu, TW;

Tzu Chieh Hsu, Hsinchu, TW;

Yi Ming Chen, Hsinchu, TW;

Hsin-Chih Chiu, Hsinchu, TW;

Chih-Chiang Lu, Hsinchu, TW;

Chia-Liang Hsu, Hsinchu, TW;

Chun-Hsien Chang, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/48 (2013.01); H01L 25/167 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/385 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01);
Abstract

The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 μm; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.


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