The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Mar. 24, 2016
Applicants:

Chan-long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Fatt Foong, Goleta, CA (US);

Inventors:

Chan-Long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Fatt Foong, Goleta, CA (US);

Assignee:

CBRITE INC., Goleta, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 21/70 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 27/124 (2013.01); H01L 27/1225 (2013.01); H01L 27/1288 (2013.01); H01L 29/66969 (2013.01); H01L 29/78606 (2013.01); H01L 29/78696 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/707 (2013.01);
Abstract

A method of fabricating MO TFTs includes positioning opaque gate metal on a transparent substrate to define a gate area. Depositing gate dielectric material overlying the gate metal and a surrounding area, and depositing metal oxide semiconductor material thereon. Depositing etch stop material on the semiconductor material. Positioning photoresist defining an isolation area in the semiconductor material, the etch stop material and the photoresist being selectively removable. Exposing the photoresist from the rear surface of the substrate and removing exposed portions to leave the etch stop material uncovered except for a portion overlying and aligned with the gate metal. Etching uncovered portions of the semiconductor material to isolate the TFT. Using the photoresist, selectively etching the etch stop layer to leave a portion overlying and aligned with the gate metal and defining a channel area in the semiconductor material. Depositing and patterning conductive material to form source and drain areas.


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