The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Mar. 03, 2016
Applicant:
Inotera Memories, Inc., Taoyuan, TW;
Inventor:
Shing-Yih Shih, New Taipei, TW;
Assignee:
INOTERA MEMORIES, INC., Taoyuan, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3135 (2013.01); H01L 23/3171 (2013.01); H01L 23/49816 (2013.01); H01L 24/29 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/29184 (2013.01);
Abstract
A semiconductor package includes an RDL interposer having a first side, a second side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a first molding compound disposed on the first side covering the at least one semiconductor die; a plurality of solder bumps or solder balls mounted on the second side; and a second molding compound disposed on the second side surrounding the plurality of solder bumps or solder balls and covering the vertical sidewall of the RDL interposer.