The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Jun. 24, 2016
Rohm Co., Ltd., Kyoto, JP;
Akihiro Koga, Kyoto, JP;
Toichi Nagahara, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
A semiconductor device includes a resin package, a semiconductor chip sealed in the package and having first and second pads on a front surface. An island of the device has a projecting terminal sealed in the package, to one surface of which a back surface of the chip is bonded, and the other surface of which is partially exposed from a bottom surface of the package as a first terminal. A lead separate from the island is sealed in the package and has one surface electrically connected with the second pad, and another surface exposed from the package bottom surface as a second terminal capable of electrical connection between the second pad and outside. A mass center of the chip is away from a center of the package, the projecting terminal is as large as the lead, and solder under the device spreads to the island projecting terminal.