The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Aug. 29, 2014
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Jui-Ying Lin, Hsinchu County, TW;

Chia-Hsin Chao, Taichung, TW;

Shu-Mei Yang, Hsinchu County, TW;

Chun-Hsing Lee, Hsinchu, TW;

Chien-Chun Lu, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 23/48 (2006.01); H01L 21/306 (2006.01); H01L 27/02 (2006.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/34 (2006.01); G02B 6/34 (2006.01); H01L 29/861 (2006.01); H01L 23/60 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G02B 6/12 (2013.01); G02B 6/34 (2013.01); H01L 21/30604 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/49827 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/0255 (2013.01); H01L 29/861 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01); H01S 5/026 (2013.01); H01S 5/0208 (2013.01); H01S 5/02469 (2013.01); H01S 5/34 (2013.01); G02B 2006/12061 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 2224/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48148 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.


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