The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
May. 09, 2014
Applicant:
Siliconfile Technologies Inc., Gyeonggi-do, KR;
Inventors:
Heui Gyun Ahn, Gyeonggi-do, KR;
Sang Wook Ahn, Gyeonggi-do, KR;
Yong Woon Lee, Gyeonggi-do, KR;
Huy Chan Jung, Gyeonggi-do, KR;
Sung Chun Jun, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/58 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/522 (2013.01); H01L 23/5226 (2013.01); H01L 25/0657 (2013.01); H01L 23/585 (2013.01); H01L 27/0688 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.