The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Sep. 27, 2011
Applicants:

Atsushi Watanabe, Toyota, JP;

Manabu Kitamura, Miyoshi, JP;

Hajime Watanabe, Toyota, JP;

Shingo Hashimoto, Okazaki, JP;

Takanori Oota, Anjo, JP;

Inventors:

Atsushi Watanabe, Toyota, JP;

Manabu Kitamura, Miyoshi, JP;

Hajime Watanabe, Toyota, JP;

Shingo Hashimoto, Okazaki, JP;

Takanori Oota, Anjo, JP;

Assignees:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-Shi, JP;

AISIN AW CO., LTD., Anjo-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H01F 41/04 (2006.01); H02K 15/04 (2006.01); H02K 3/12 (2006.01);
U.S. Cl.
CPC ...
H01F 41/04 (2013.01); H02K 3/12 (2013.01); H02K 15/0421 (2013.01); Y10T 29/4902 (2015.01);
Abstract

In a segment coil manufacturing method for manufacturing a segmented coil by bending a flat rectangular conductor using a forming die so that the segmented coil has a circular arc section, a crank section, and a protrusion-shaped section, the forming die includes an outer peripheral surface forming upper die, an inner peripheral surface forming upper die, an inner peripheral surface forming lower die, and an outer peripheral surface forming lower die, and the method includes forming the circular arc section, the crank section, and the protrusion-shaped section while holding at least two surfaces of the outer peripheral surfaces of the flat rectangular conductor by the outer peripheral surface forming upper die, the inner peripheral surface forming upper die, the inner peripheral surface forming lower die, and the outer peripheral surface forming lower die.


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