The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Apr. 17, 2015
Applicants:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Xin-Yuan Wu, Shenzhen, CN;

Chih-Kuang Chang, New Taipei, TW;

Peng Xie, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/46 (2006.01); G06K 9/66 (2006.01); G06K 9/52 (2006.01);
U.S. Cl.
CPC ...
G06K 9/52 (2013.01); G06K 9/46 (2013.01); G06K 2009/4666 (2013.01);
Abstract

A method for patching up a point cloud comprises obtaining a point cloud and a predetermined interval and a filtering parameter of curvature. Then a void in the point cloud which needs to be patched up is identified. A minimum encasing box is created to enclose the void. Points inside the minimum encasing box and outside the void are selected to create a B-spline curve surface. The B-spline curve surface are interpolated by the predetermined interval to obtain a plurality of discrete points which are used to patch up the void. Messy points in the void according to the predetermined interval and the filtering parameter of curvature are determined and deleted. Positions of the points in the void are adjusted along their normal vector directions to smooth the point cloud.


Find Patent Forward Citations

Loading…