The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Dec. 14, 2012
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Takashi Shindo, Osaka, JP;

Yoshiyuki Uchinono, Osaka, JP;

Kimitake Okugawa, Osaka, JP;

Noboru Urata, Osaka, JP;

Syoji Kuroki, Osaka, JP;

Akira Fukuoka, Osaka, JP;

Atsushi Sakaguchi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); G05B 19/18 (2006.01); B23P 23/04 (2006.01); B23K 26/08 (2014.01); G05B 19/401 (2006.01); B23Q 39/02 (2006.01);
U.S. Cl.
CPC ...
G05B 19/18 (2013.01); B23K 26/0624 (2015.10); B23K 26/0823 (2013.01); B23K 26/0853 (2013.01); B23K 26/0876 (2013.01); B23P 23/04 (2013.01); B23Q 39/024 (2013.01); G05B 19/401 (2013.01); G05B 2219/49376 (2013.01); G05B 2219/50088 (2013.01);
Abstract

There is provided a method for determining a machining means in a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece; and a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means, wherein a choice is made between the electromagnetic-wave-machining means and the precision-machining means in the determination of the machining means, on the basis of: information on a stereoscopic model of the micro-machined product; information on a removal volume to be removed from a volume of the workpiece in the manufacturing of the micro-machined product; and data on a removal process time of the electromagnetic-wave-machining means and data on a removal process time of the precision-machining means.


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