The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Dec. 18, 2012
Applicant:

Daniel A. Armstrong, Simi Valley, CA (US);

Inventor:

Daniel A. Armstrong, Simi Valley, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21K 99/00 (2016.01); F21S 8/00 (2006.01); F21V 29/70 (2015.01); F21V 19/00 (2006.01); F21V 23/02 (2006.01); F21V 29/507 (2015.01); F21K 9/23 (2016.01); F21V 31/00 (2006.01); F21V 19/04 (2006.01); F21W 131/401 (2006.01); F21Y 101/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/13 (2013.01); F21K 9/23 (2016.08); F21S 8/00 (2013.01); F21V 19/003 (2013.01); F21V 23/02 (2013.01); F21V 29/20 (2013.01); F21V 29/507 (2015.01); F21V 29/70 (2015.01); F21V 19/042 (2013.01); F21V 31/005 (2013.01); F21W 2131/401 (2013.01); F21Y 2101/00 (2013.01); Y10T 29/49117 (2015.01);
Abstract

Embodiments of the invention provide an LED replacement light assembly for retrofitting an incandescent light fixture that has a housing with a base. The LED replacement light assembly can include a shaft with a top portion and a lower threaded portion. The lower threaded portion can be screwed into the base. The LED replacement light assembly can also include an LED adapter, and a circuit board including a plurality of LEDs. One embodiment can include a thermally conductive disc that can engage the circuit board and the housing to conduct heat from the circuit board to the housing. A thermal interface can be positioned between the thermally conductive disc and the housing to provide enhanced conduction.


Find Patent Forward Citations

Loading…