The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Sep. 10, 2007
Applicants:

Trifon M. Liakopoulos, Bridgewater, NJ (US);

Robert W. Filas, Basking Ridge, NJ (US);

Amrit Panda, San Jose, CA (US);

Inventors:

Trifon M. Liakopoulos, Bridgewater, NJ (US);

Robert W. Filas, Basking Ridge, NJ (US);

Amrit Panda, San Jose, CA (US);

Assignee:

Enpirion, Inc., Bridgewater, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 1/04 (2006.01); C25B 9/00 (2006.01); C25D 17/06 (2006.01); C25D 17/00 (2006.01); C25D 17/08 (2006.01); C25D 21/12 (2006.01); C25D 17/02 (2006.01); C25D 13/22 (2006.01); C25D 3/56 (2006.01); C25D 17/12 (2006.01); C25D 21/10 (2006.01); C25D 21/11 (2006.01); C25D 5/00 (2006.01);
U.S. Cl.
CPC ...
C25D 3/562 (2013.01); C25D 5/003 (2013.01); C25D 17/001 (2013.01); C25D 17/12 (2013.01); C25D 21/10 (2013.01); C25D 21/11 (2013.01);
Abstract

An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.


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