The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Nov. 25, 2014
Applicant:

Korea Institute of Machinery & Materials, Daejeon, KR;

Inventors:

Sang-Kwan Lee, Changwon-si, KR;

Sang-Bok Lee, Gimhae-si, KR;

Jung-Yeul Yun, Changwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); F28F 21/04 (2006.01); B29C 67/04 (2017.01); B32B 18/00 (2006.01); C04B 41/88 (2006.01); C04B 41/00 (2006.01); C04B 41/45 (2006.01); H01L 23/373 (2006.01); B22F 7/06 (2006.01); C22C 32/00 (2006.01); C04B 35/645 (2006.01); F21V 29/85 (2015.01); F21V 29/89 (2015.01); B32B 5/18 (2006.01); B32B 15/04 (2006.01); B32B 5/16 (2006.01); B32B 7/04 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); F28F 21/08 (2006.01); F28F 13/00 (2006.01); H01L 33/64 (2010.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B22F 7/062 (2013.01); B29C 67/04 (2013.01); B32B 5/16 (2013.01); B32B 5/18 (2013.01); B32B 7/04 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/04 (2013.01); B32B 18/00 (2013.01); C04B 35/645 (2013.01); C04B 41/009 (2013.01); C04B 41/4523 (2013.01); C04B 41/88 (2013.01); C22C 32/0005 (2013.01); C22C 32/0021 (2013.01); C22C 32/0036 (2013.01); C22C 32/0047 (2013.01); C22C 32/0052 (2013.01); C22C 32/0068 (2013.01); F21V 29/86 (2015.01); F21V 29/89 (2015.01); F28F 21/04 (2013.01); H01L 23/3731 (2013.01); H01L 23/3733 (2013.01); B32B 2250/03 (2013.01); B32B 2264/107 (2013.01); B32B 2307/302 (2013.01); C04B 2111/00844 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/361 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/586 (2013.01); C04B 2237/704 (2013.01); F28F 13/003 (2013.01); F28F 21/08 (2013.01); H01L 33/642 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24992 (2015.01); Y10T 428/249957 (2015.04);
Abstract

The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.


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