The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Dec. 07, 2012
Applicant:

Mitsui Chemicals Tohcello, Inc., Chiyoda-ku, JP;

Inventors:

Shinichi Usugi, Chiba, JP;

Noboru Kawasaki, Sakura, JP;

Jun Kamada, Narashino, JP;

Takuzo Aida, Bunkyo-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/08 (2006.01); C07D 319/06 (2006.01); C09J 201/02 (2006.01); H01L 21/683 (2006.01); C09J 133/14 (2006.01); B32B 43/00 (2006.01); C09J 7/02 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); C09J 201/08 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); B32B 43/006 (2013.01); C07D 319/06 (2013.01); C09J 7/0217 (2013.01); C09J 7/0225 (2013.01); C09J 133/14 (2013.01); C09J 201/02 (2013.01); C09J 201/08 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); C08L 2203/14 (2013.01); C09J 2203/326 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83191 (2013.01); Y10T 156/1153 (2015.01); Y10T 428/1476 (2015.01);
Abstract

An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.


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